Besi Leshan(Formerly known as Fico Tooling Leshan) is established in 2002，China as a joint venture between Be Semiconductor industries (Netherlands) and Leshan Radio Company. Besi Leshan design and manufacture of micron standard precision molds and semiconductor packaging equipment mainly used in semiconductor industry. 乐山博思半导体有限公司（原乐山飞舸模具有限公司）成立于2002年，是荷兰比尔半导体工业有限公司和乐山无线电股份有限公司兴建的中外合资企业。乐山博思半导体有限公司主要设计制造微米标准的精密模具和半导体封装设备，其产品主要用于半导体工业。