Lead Application Engineer (数字后端)
- 30万-45万/年
- 深圳
- |
- 3年以上
- |
- 本科
- |
- 全职
职位诱惑: 老板nice,股票期权,成长空间大,技术领先
发布时间: 2021-01-12发布
职位描述
Position Description:
1. To provide key technical support in digital IC design implementation, product demonstration, and sales presentations.
2. To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, including both challenging low power and high-performance designs.
3. Have real design experience including floorplan and partition, place, CTS, route, STA timing closure, Physical verification, RC extraction, Power Network analysis.
4. Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoC designs.
5. To play a leading role among other team members, while receive little instruction on routine and general assignments.
Position Requirements:
1. A bachelor's degree is essential and 3+ years’ experience in IC design, electronic engineering or computer science applications.
2. Ability to understand and articulate technical issues, (and knowledge of) design products and their applications.
3. Requires working knowledge of one or more programming languages, and effective communication and soft skills.
4. An MS degree and/or working experience in multi-nation IC design house/or familiar with EDI/Innovus product is a plus.
5. Good communication in English and good work attitude.
6. Be familiar with shell/Perl/Tcl etc. script language.
职位发布者
cadence hr
Sr.Manager&BP
简历处理用时
简历及时处理率
Cadence
领域: 移动手持,消费电子,通信网络
规模: 500-1000人
主页: http://www.cadence.com.cn/
工作地址:
福田区深南大道7888号东海国际中心
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