Physical Design Intern(实习生)
- 2万-3万/年
- 上海
- |
- 应届生/在校生
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- 本科
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- 实习
职位诱惑: 福利好,老板nice
发布时间: 2018-08-21发布
职位描述
Job Responsibilities:
• Work in physical design team for large scale ASIC chip physical implementation.
• Focus on physical design of deep sub-micron SOC chips for block level floor planning, timing closure, place&route, physical verification etc.
• The individual is expected to be accountable for block level project delivery.
Job Requirements:
• Familiar with ASIC backend design flow/methodology.
• Knowledgeable in deep submicron ASIC design.
• Strong problem solving skills, and attention to details
• Good interpersonal skills (verbal and written)
• Dedicated, hardworking and good team player
• Familiar with Unix/Linux environment and good at scripts
• Familiar with Back-End (physical design) EDA tools is a plus.
EDUCATION:
Bachelor of EE or CS. 4-5 days working per week.