PD

Responsibilities:

Chip Design Engineers are working on cutting-edge SoC (System on a Chip), ASIC, High Performance Processor, Chipset, Digital/Analog and Mix-signal Circuit IP design for our clients inside and outside of GLOBALFOUNDRIES. By employing the industry leading tools, state of the art methodology, and innovative semiconductor technologies ranging from 45nm to 14nm and beyond, you will be participating in the development of :
1. Back-end implementation and optimization
2.Package and electrical design,
3. Electronic Design Automation (EDA) & methodology development and deployment
4. Chip hardware validation


Requirements:

1. CS/EE or background in areas related to digital or analog chip design
2. 2 year+ work experience
3. Research and development experience in one or more of the following areas:
4. ASIC back-end design methodology: Knowledge of floor planning, physical design, timing, DFT, signal/power integrity, packaging, synthesis, and other back-end activities
5. EDA algorithm, tool, and methodology development.
6. Experience/knowledge in analog and mixed-signal IP design, test and evaluation with Bulk CMOS, BiCMOS, SiGe, or SOI technologies
7.- Proficiency in Verilog/VHDL, and familiarity with programming and scripting languages is a significant plus
8. Experience in one or some of the application domains, will be a plus
9. High performance computing (servers) system, processor, chipset and ASICs
10. Communication, networking and wireless applications
11. Digital signal processing and RISC Processor architecture
12. Digital media, audio/video graphic and gaming processing
13. Consumer electronics applications
14. High Speed Interface/Serdes applications
15. Good software background and strong C/C++ skill
16. Other emerging technology and industry areas
17. Good English skills, communication skills, and willingness to work with a global team. Skill in other languages will be a plus.
18. Good learning competency and ability to work in diverse areas in a flexible environment