关注微信 意见反馈

扫描关注摩尔人半导体招聘

摩尔人招聘
确定

您已提交成功

查看帮助中心
对职位有兴趣?上传您的简历无需注册,即可直接投递您心仪的职位
AMD

ASIC Physical Design Engineer - multiple levels

收藏职位
  • 我要分享
  • 30万-60万/年
  • 北京
  • |
  • 3年以上
  • |
  • 本科
  • |
  • 全职

职位诱惑: 技术领先,成长空间大,技能培训,年底双薪,年终奖金,五险一金

发布时间: 2019-02-25发布

职位描述

Role & Responsibilities:
Work with global Front-End design team and physical design team for large scale ASIC chip physical implementation. Focus on physical design of deep sub-micron GPU chips including block level (full chip) floor planning, timing closure, place & route, physical verification etc. The individual is expected to be an expert in multiple aspects in PD areas and provide technically leadership to the engineering team. The individual is also expected to be accountable for project delivery.
 
Job Requirements:
-      MSEE or Bachelor with 3 – 20 of industrial experience in ASIC physical design
-      Experience in physical design of deep submicron digital ASIC chips
-      Hands on experience in large scale ASIC chip physical design
-      Knowledgeable in all aspects of deep submicron ASIC design flow
-      Successfully gone through several complete product development cycles
-      Demonstrate strong leadership and work well with cross-functional teams
-      Good listening, writing and speaking English
-      Good communication skills, strong interpersonal skills and the flexibility
-      Dedicated, hardworking and good team player
-      Familiar with Back-End (physical design) EDA tools
-      Familiar with Front-End EDA tools is a plus
-      Familiar with Unix/Linux environment and good at scripts

职位发布者

AMD

HR

7天

简历处理用时

100%

简历及时处理率

您还未登录。已有账号, 点此登录,直接投递

推荐朋友

一键投递