Principal Application Engineer (Physical Design)

Position Description:
To provide key technical support in digital IC design implementation, product demonstration, and sales presentations.
To demonstrate strong ability and to be hands-on in RTL-to-GDSII design methodology, for challenging low power designs, for 200MHz to several GHz big chips.
Have real design experience including conformal check, logic synthesys, P&R, CTS, SSTA, MMMC to close timing, power and die area.
 
Assist in technical evaluation, assessment and delivery of concurrent ASIC/SoC designs.
To play a leading role among other team members, while receive little instruction on routine and general assignments.
 
Position Requirements:        
A bachelor's degree is essential and 6+ years’ experience in IC design, electronic engineering or computer science applications.
Ability to understand and articulate technical issues, (and knowledge of) design products and their applications.
Requires working knowledge of one or more programming languages, and effective communication and soft skills.
An MS degree and/or working experience in multi-nation IC design house is a plus.