Wafer Bonding Principle EE

1、Understand the wafer-level permanent bonding and temporary bonding equipment’s features, and can to evaluate and improvement;          
2、Optimize wafer bond area equipment maintenance target and specifications, and propose specific solutions;           
3、Reduce the cost of maintenance and repair of wafer bond and post related equipment;
4、Responsible for wafer bond and related equipment’s key parts and spare parts management;          
5、Responsible for wafer bonder and related equipment spare parts evaluation and purchase suggestion;        
6、Responsible for the improvement of equipment OEE and WPH;           
7、Special tasks that need to be solved wafer bonder and related equipment’s;
8、Responsible for decision related equipment release to process;
9、Responsible for training of new equipment engineers
1、了解晶圆级临时键合和永久键合设备特性并能进行评估、改进；
2、优化键合及后段相关设备保养目标、规范，并提出具体方案；
3、降低键合及后段相关设备保养及维修成本；
4、负责键合及后段相关设备备件管理；
5、负责键合及后段相关设备备件评估及购买建议
6、负责设备OEE、WPH提升方面提出改进方案；
7、执行键合及后段相关设备需解决的特殊任务
8、负责决策键合及后段相关设备release至制程
9、负责训练新进设备工程师
公司将委派赴瑞典培训

任职要求：
1、More than 8 years experiences of equipment engineer in 8'or 12'FAB;
2、Experience in operation and maintenance of wafer bonder EVG or SUSS, and have high-level off-site training;
3、Strong hands-on and communication skills, and could transform equipment;
4、Knowledge of SPC\DOE\FMEA and so on;
5、Skilled use of MS、 analysis software;
6、Have an outstanding of English ability;
7、Have a sense of innovation and team work.
1、 五年以上8寸或12寸半导体FAB设备工程师工作经验；
2、 对晶圆键合EVG或SUSS设备操作、维修保养经验，并接受过高等级场外培训；
3、 极强的动手能力和沟通协调能力，能够独立提出改装机台的可行性技术方案并实施；
4、 有SPC\DOE\FMEA等知识；
5、 能熟练应用Word、Excel、PPT等办公软件；
6、 英文能力突出；
7、工作认真细致，有创新意识，有团队精神。