IC Design Engineer
- 22万-28万/年
- 北京
- |
- 应届生/在校生
- |
- 硕士
- |
- 全职
职位诱惑: 年终奖金,五险一金,老板nice,福利好,年底双薪,交通补助,技术领先,技能培训
发布时间: 2018-06-15发布
职位描述
IC Design Engineer (Campus Hire)
Location: Beijing
Position Area:
● (Logic) Logic Design and Verification Engineer
● (Backend) Backend Design Engineer (DFT/PD/Timing/Package/Noise)
● (Analog) Analog Circuit and Layout Design Engineer
● (Memory) Memory Design Engineer
Responsibilities:
GLOBALFOUNDRIES IC Design Engineer will be working on most cutting-edge SoC (System on a Chip), ASIC, Digital, Mixed-Signal or Memory IP development for GLOBALFOUNDRIES WW clients. By employing the industry leading tools, methodology, and world-class semiconductor technologies ranging from 22nm, 14/12nm to 7nm and beyond, you will have the opportunities to participate in the delivery of various end-to-end silicon solutions, including architecture design and performance assessment, front-end logic design and verification, back-end implementation and optimization, a variety of IP development, methodology development and deployment, as well as chip hardware validation and support.
Requirements:
1. EE/CS or equivalent background in digital, analog or mixed-signal IC design related areas.
2. Research and development experience in one or more of the following skill areas:
● Architectural design, assessment, and optimization
● Proficient in Verilog/VHDL, and well conversant with programming and scripting languages
● Digital logic design and verification on the basis of the target system/IP specification
● SoC design methodology: Knowledge of SoC integration, modeling, verification and simulation at different abstract levels
● ASIC back-end design methodology: Knowledge of synthesis, timing, DFT, floorplanning, physical design, signal/power integrity, packaging, and other back-end activities
● Analog or mixed-signal circuit design, validation, implementation and test on Bulk CMOS, FinFET, or SOI technologies
● Electronic Design Automation algorithm, tool, and methodology development
3. Research and development experience in one or more of the following application domains, will be a plus:
● Communication, Wired and Wireless Networking
● Edge Computing, Artificial Intelligence, Machine Learning
● Data Center, High Performance Computing, Storage
● Mobile, Automotive, Internet of Things (IoT)
● Other emerging technology and industry areas
4. Good English and communication skills, and willingness to work with a global culture team. Skill of other languages will be a plus.
5. Good learning competency and be able to work in diverse areas in a dynamic environment.